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IPC-7093:[PDF FILE ]Design and Assembly Process Implementation for Bottom

IPC-7093:[PDF FILE ]Design and Assembly Process Implementation for Bottom

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IPC-7093:Design and Assembly Process Implementation for Bottom Termination Components
Revision: 2011
Language: English

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This document describes the design and assembly challenges for implementing Bottom Termination surface mount Components (BTCs) whose external connections consist of metallized terminations that are an integral part of the component body. Throughout this document the word "BTC" can mean all types and forms of bottom only termination components intended for surface-mounting. This includes such industry descriptive nomenclature as QFN, DFN, SON, LGA, MLP, and MLF, which utilize surface to surface interconnections. The focus of the information contained herein is on critical design, assembly, inspection, repair, and reliability issues associated with BTCs.


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