This is a PDF file (eBook), NOT a hard copy.
IPC-7092:Design and Assembly Process Implementation for Embedded
This document describes the design and assembly challenges for
implementing passive and active components, in either formed or
placed methodology, into a printed board. The completed structure
including internal electronic components is ready for surface mount
and/or through-hole component attachment. The multilayered
structure becomes a complete product ready for further processing
in an assembly process and can be made from organic, inorganic
(ceramic) or both types of material.